Senior Thermal-Mechanical Engineer (Physics AI) – European Forward Deployment Lead

As a pivotal leader within our European Forward Deployment team, you will drive the adoption of Vinci’s platform among the region's top engineering organizations. In this strategic role, you will build, mentor, and guide a high-performing team of thermal engineers dedicated to engaging prospective customers and demonstrating our software's transformative value.

Core Responsibilities:

• Build, lead, and scale a high-performing team of thermo-mechanical engineers, setting the technical direction, hiring, mentoring team members, and driving field execution across Europe.
• Collaborate closely with the sales team to lead technical discussions, scope proof-of-concept (PoC) evaluations, and deliver compelling product demonstrations to prospective enterprise customers.
• Guide customer engineering teams through the evaluation phase by overseeing simulation setup, running complex test cases, and interpreting results to explicitly prove Vinci’s technical and business value.
• Own customer enablement through onboarding, deployment pipeline, and account expansion, providing senior technical guidance, structured training sessions, and advanced troubleshooting.
• Provide product guidance and feedback, identify customer pain points and workflow bottlenecks, partnering directly with internal product and engineering teams to transform field feedback into critical new product features.
• Represent Vinci at major industry conferences and semiconductor events, engaging technically with key prospects and partners through technical presentations and live platform demonstrations.
• Maintain a strong understanding of competitive technologies, industry trends, and market positioning to communicate Vinci’s differentiators effectively.

Key Focus Areas:

• Leverage expertise in continuum mechanics to analyze complex physical phenomena, including linear, geometric, and material nonlinearities, and contact interactions.
• Evaluate critical factors such as warpage, stress evolution, thermal cycling, and reliability across advanced semiconductor devices, electronics packages, and wafer-scale systems.
• Work closely with customer engineering teams to understand their technical challenges and provide expert guidance.
• Serve as a key feedback channel to product and engineering teams, translating customer insights into actionable inputs for product direction.

Qualifications (Minimum):

• Education: Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field.
• Technical depth: Expert-level mastery of commercial simulation software (e.g., Ansys, Abaqus) with 15+ years of hands-on experience in thermo-mechanical simulations.
• Industry Domain: Deep familiarity with semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems.
• Customer Engagement: Prior experience in dedicated customer-facing roles, with a strong ability to build trust and manage engineering client relationships.
• Automation & Scripting: Practical programming experience using Python or C++ to automate workflows or parse simulation data.
• Leadership Impact: Proven track record of managerial or technical leadership experience, with the ability to scale, mentor, and drive execution across engineering teams.
• Communication: Elite interpersonal and communication skills, with a proven ability to distill complex physics and simulation results into clear narratives for technical and business audiences.

Preferred Qualifications:

• Familiarity with thermal solutions management and/or Electrical Signal Integrity (SI) and Power Integrity (PI) workflows.
• Direct experience commercializing technical software, ideally Electronic Design Automation (EDA) or CAE simulation tools in semiconductor and electronics enterprises.
• Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments.
• Ability to rapidly adopt and champion next-generation, physics-based workflows and AI-assisted design or simulation tools.

Work Environment:

The role is remote with moderate travel primarily within continental Europe and infrequent intercontinental travel for US team collaboration.